ACD-02 · Electronics & repair technologies
BGA/LGA rework and reballing
The complete process of replacing and refurbishing BGA and LGA packages — thermal profiles, reballing, joint quality control and X-ray inspection.
- Duration
- 3 days
- Group
- up to 4 people
- Location
- A&D lab
Technical programme
01
Process preparation
- — Component moisture sensitivity and baking (MSL)
- — Developing thermal profiles
- — Protecting adjacent components
02
Removal, reballing, placement
- — Safe removal and pad cleaning
- — Reballing — stencils, spheres, flux
- — Alignment and soldering on a rework station
03
Quality control
- — X-ray inspection — voids, bridges, misalignment
- — Typical defects and their root causes
Who it is for
- Electronics repair technicians
- OEM production and service teams
- Repair depot laboratories
Competencies gained
- A repeatable BGA/LGA rework process
- Interpreting X-ray images of joints
- Assessing multilayer laminate damage risk
Hands-on part
- Exercises on rework stations in the A&D lab
- Reballing on test boards
- X-ray analysis of participants' own joints
Ask about a training programme
For companies, military units, repair depots and OEMs. Programme, dates and location are tailored to your team and the equipment it works with.
The programme can be tailored to your equipment and team. References to standards do not imply certification.