ACD-03 · Electronics & repair technologies
Professional THT/SMD repair technologies
Soldering and replacement techniques for through-hole and surface-mount components, track and pad repair, and joint inspection — with reference to IPC standard requirements.
- Duration
- 2–3 days
- Group
- up to 6 people
- Location
- A&D lab or on-site
Technical programme
01
Soldering and component replacement
- — THT, SMD and fine-pitch parts (QFP, QFN, SOIC)
- — Hot air, iron, bottom preheating
- — Fluxes, alloys and cleaning
02
PCB repair
- — Rebuilding tracks and pads
- — Via and laminate repair
- — Modifications and jumper wires
03
Inspection
- — Joint acceptance criteria with reference to IPC-A-610 and IPC-7711/7721
- — Optical and microscope inspection
Who it is for
- Electronics technicians
- Service and production teams
- Quality control staff
Competencies gained
- Safe component replacement without laminate damage
- Repair of mechanical PCB damage
- Assessing solder joint quality
Hands-on part
- Exercises at ESD-safe workstations
- Repairs on damaged test boards
- Peer inspection and evaluation
Ask about a training programme
For companies, military units, repair depots and OEMs. Programme, dates and location are tailored to your team and the equipment it works with.
The programme can be tailored to your equipment and team. References to standards do not imply certification.