ACD-05 · Reliability engineering
Thermal reliability and thermographic diagnostics of electronics
Heat is one of the main causes of electronic failure. This programme combines thermographic diagnostics, thermal management and root-cause analysis to extend equipment life.
- Duration
- 2 days
- Group
- up to 8 people
- Location
- A&D lab or on-site
Technical programme
01
Thermal diagnostics
- — Thermography — emissivity, resolution, interpretation
- — Detecting hot spots and degradation
- — Measurements under load
02
Thermal management
- — Thermal interface materials and heatsinks
- — Airflow in enclosures and racks
- — Temperature effects on capacitors and semiconductors
03
Analysis and prevention
- — Root-cause analysis of failures (RCA)
- — Prevention and life-extension plans
Who it is for
- Maintenance engineers
- Critical-systems service teams
- Reliability engineers
Competencies gained
- Reliable interpretation of thermal images
- Identifying causes of overheating
- Designing preventive actions
Hands-on part
- Thermal camera measurements on live modules
- RCA exercise on a real failure case
- Evaluating cooling improvements
Ask about a training programme
For companies, military units, repair depots and OEMs. Programme, dates and location are tailored to your team and the equipment it works with.
The programme can be tailored to your equipment and team. References to standards do not imply certification.